IEC 60749-15-2003 半导体器件.机械和气候试验方法.第15部分:通孔安装设备的耐钎焊温度
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【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Part15:Resistancetosolderingtemperatureforthrough-holemounteddevices
【原文标准名称】:半导体器件.机械和气候试验方法.第15部分:通孔安装设备的耐钎焊温度
【标准号】:IEC60749-15-2003
【标准状态】:作废
【国别】:国际
【发布日期】:2003-02
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:半导体;气候试验;电学测量;气候;元部件;试验;集成电路;环境试验;电子工程;电气工程;耐钎焊温度;电子设备及元件;机械试验;通孔安装;半导体器件
【英文主题词】:Climate;Climatictests;Components;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Mechanicaltesting;Semiconductordevices;Semiconductors;Solderingtemperatureresistance;Testing;Trough-holemounting
【摘要】:ThispartofIEC60749describesatestusedtodeterminewhetherencapsulatedsolidstatedevicesusedforthrough-holemountingcanwithstandtheeffectsofthetemperaturetowhichtheyaresubjectedduringsolderingoftheirleadsbyusingwavesolderingorasolderingiron.Inordertoestablishastandardtestprocedureforthemostreproduciblemethods,thesolderdipmethodisusedbecauseofitsmorecontrollableconditions.Thisproceduredetermineswhetherdevicesarecapableofwithstandingthesolderingtemperatureencounteredinprintedwiringboardmanufacturingoperations,withoutdegradingtheirelectricalcharacteristicsorinternalconnections.Thistestisdestructiveandmaybeusedforqualification,lotacceptanceandasaproductmonitor.Thistestis,ingeneral,inconformitywithIEC60068-2-20but,duetospecificrequirementsofsemiconductors,theclausesofthisstandardapply.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:20P;A4
【正文语种】:英语
【原文标准名称】:半导体器件.机械和气候试验方法.第15部分:通孔安装设备的耐钎焊温度
【标准号】:IEC60749-15-2003
【标准状态】:作废
【国别】:国际
【发布日期】:2003-02
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:半导体;气候试验;电学测量;气候;元部件;试验;集成电路;环境试验;电子工程;电气工程;耐钎焊温度;电子设备及元件;机械试验;通孔安装;半导体器件
【英文主题词】:Climate;Climatictests;Components;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Environmentaltesting;Integratedcircuits;Mechanicaltesting;Semiconductordevices;Semiconductors;Solderingtemperatureresistance;Testing;Trough-holemounting
【摘要】:ThispartofIEC60749describesatestusedtodeterminewhetherencapsulatedsolidstatedevicesusedforthrough-holemountingcanwithstandtheeffectsofthetemperaturetowhichtheyaresubjectedduringsolderingoftheirleadsbyusingwavesolderingorasolderingiron.Inordertoestablishastandardtestprocedureforthemostreproduciblemethods,thesolderdipmethodisusedbecauseofitsmorecontrollableconditions.Thisproceduredetermineswhetherdevicesarecapableofwithstandingthesolderingtemperatureencounteredinprintedwiringboardmanufacturingoperations,withoutdegradingtheirelectricalcharacteristicsorinternalconnections.Thistestisdestructiveandmaybeusedforqualification,lotacceptanceandasaproductmonitor.Thistestis,ingeneral,inconformitywithIEC60068-2-20but,duetospecificrequirementsofsemiconductors,theclausesofthisstandardapply.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:20P;A4
【正文语种】:英语
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